Continued working the LG circuit card cover mold. A little bondo, sanding, etc. I have now applied a first coat of laminating epoxy to the mold to seal the wood. I will sand this, add another coat on top, sand this, then paint with primer to ready it for use. The epoxy I use was Z-Poxy laminating resin from Pacer Industries. It is epoxy that I have used to sheet styrofoam wings on RC planes in the past (I had some on the self).
